A Freestanding, Dissolution- and Diffusion-Limiting, Flexible Sulfur Electrode Enables High Specific Capacity at High Mass Loading.

The acquisition of stable and high-areal-capacity S cathodes over 10 mA h cm-2 is a critical and indispensable step to realize the high energy density configuration. However, increasing the areal capacity of S cathodes often deteriorates the specific capacity and stability due to the aggravated dissolution of S and diffusion of solvable polysulfides in the thick electrode. Herein, the design of a freestanding composite cathode that leverages 3D covalent binding sites and chemical adsorption environment to offer dissolution-limiting and diffusion-blocking functions of S species is reported. By employing this architecture, the coin cell exhibits excellent cycling stability and an exceptional specific capacity of 1444.3 mA h g-1 (13 mA h cm-2 ), and the pouch cell configuration manifests a noteworthy areal capacity exceeding 11 mA h cm-2 . This performance is coupled with excellent flexibility, demonstrated through consecutive bending cycle tests, even at a sulfur loading of 9.00 mg cm-2 . This study lays the foundation for the development of flexible Li-S batteries with increased loading capacities and exceptional performance.

Stretchable and Self-Healable Fiber-Shaped Conductors Suitable for Harsh Environments.

Fiber-shaped conductors with high electrical conductivity, stretchability, and durability have attracted increasing attention due to their potential for integration into arbitrary wearable forms. However, these fiber conductors still suffer from low reliability and short life span, particularly in harsh environments. Herein, a conductive, environment-tolerant, stretchable, and healable fiber conductor (CESH), which consists of a self-healable and stretchable organohydrogel fiber core, a conductive and buckled silver nanowire coating, and a self-healable and waterproof protective sheath, is reported. Such a multilayer core-sheath design not only offers high stretchability (≈2400%), high electrical conductivity (1.0 × 106 S m-1 ), outstanding self-healing ability and durability, but also possesses unprecedented tolerance in harsh environments including wide working temperature (-60-20 °C), arid (≈10 % RH (RH: room humidity)), and underwater conditions. As proof-of-concept demonstrations, CESHs are integrated into various wearable formats as interconnectors to steadily perform the electric function under different mechanical deformations and harsh conditions. Such a new type of multifunctional fiber conductors can bridge the gap in stretchable and self-healing fiber technologies by providing ultrastable electrical conductance and excellent environmental tolerance, which can greatly expand the range of applications for fiber conductors.

Elasto-Plastic Design of Ultrathin Interlayer for Enhancing Strain Tolerance of Flexible Electronics.

The ability to tolerate large strains during various degrees of deformation is a core issue in the development of flexible electronics. Commonly used strategies nowadays to enhance the strain tolerance of thin film devices focus on the optimization of the device architecture and the increase of bonding at the materials interface. In this paper, we propose a strategy, namely elasto-plastic design of an ultrathin interlayer, to boost the strain tolerance of flexible electronics. We demonstrate that insertion of an ultrathin, stiff (high Young's modulus) and elastic (high yield strain) interlayer between an upper rigid film/device and a soft substrate, regardless of the substrate thickness or the interfacial bonding, can significantly reduce the actual strain applied on the film/device when the substrate is bent. Being independent of existing strategies, the elasto-plastic design strategy offers an effective method to enhance the device flexibility without redesigning the device structure or altering the material interface.

Electrochemical Replication and Transfer for Low-Cost, Sub-100 nm Patterning of Materials on Flexible Substrates.

The fabrication of high-resolution patterns on flexible substrates is an essential step in the development of flexible electronics. However, the patterning process on flexible substrates often requires expensive equipment and tedious lithographic processing. Here, a bottom-up patterning technique, termed electrochemical replication and transfer (ERT) is reported, which fabricates multiscale patterns of a wide variety of materials by selective electrodeposition of target materials on a predefined template, and subsequent transfer of the electrodeposited materials to a flexible substrate, while leaving the undamaged template for reuse for over 100 times. The additive and parallel patterning attribute of ERT allows the fabrication of multiscale patterns with resolutions spanning from sub-100 nm to many centimeters simultaneously, which overcomes the trade-off between resolution and throughput of conventional patterning techniques. ERT is suitable for fabricating a wide variety of materials including metals, semiconductors, metal oxides, and polymers into arbitrary shapes on flexible substrates at a very low cost.